Product Description

This type of laser machine uses a high-powered laser beam to generate heat on the surface of the glass, creating microscopic cracks that lead to the formation of the desired shape of the hole. It is equipped with advanced laser optics for precise control over the drilling process, ensuring that the holes are created with high accuracy and consistency.

This machine is suitable for a wide range of applications for glass drilling, including drilling holes in glass containers, glass lenses, and glass wafers used in electronics manufacturing. It can produce holes with exceptional quality, smoothness, and clarity, enhancing the overall appearance and performance of the finished product.

Furthermore, using laser marking machines greatly improves manufacturing efficiency by eliminating the need for time-consuming and expensive mechanical drilling methods. This technology reduces the occurrence of defects and waste, resulting in a more cost-effective and environmentally friendly production process.

Product Advantages: 

• It uses a 532nm green optical source,
• It is small and convenient, and the marking angle is flexible,
• Equipped with a lifting machine, the marking height can be adjusted,
• The power of marking equipment is optional, including 3w, 5w, 8w,
• The marking operation is simple and quick to start,
• The marking effect is profound, clear and smooth,
• Mainly used for marking and surface treatment of various non-metallic materials such as glass, crystal, LCD screens, textiles, wafer ceramics, semiconductor silicon wafers, etc.

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